AM31L01DCB datasheet

Маркировка

AM31L01DCB
Производитель

AMD (Advanced Micro Devices)
Описание

AMD (Advanced Micro Devices) AM31L01DCB Mfr Package Description: HERMETIC SEALED, CERAMIC, DIP-16 Technology: TTL Package Shape: RECTANGULAR Package Style: IN-LINE Terminal Form: THROUGH-HOLE Terminal Pitch: 2.54 mm Terminal Finish: TIN LEAD Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 16 Package Body Material: CERAMIC, GLASS-SEALED Temperature Grade: COMMERCIAL EXTENDED Memory Width: 4 Organization: 16 X 4 Memory Density: 64 deg Operating Mode: ASYNCHRONOUS Number of Words: 16 words Number of Words Code: 16 Operating Temperature-Max: 75 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 5.25 V Supply Voltage-Min (Vsup): 4.75 V Supply Voltage-Nom (Vsup): 5 V Memory IC Type: STANDARD SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 80 ns
Количество страниц

8 шт.
Формат

PDF
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Размер файла

205,80 KB